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Scientific Article | Ici, l’accumulation des ions cuivreux dans une solution en une expérience de modèle et d’une analyse fondée sur des mesures
Knowledge of the behavior of cuprous ions (monovalent copper ion: Cu(I)) in a copper sulfate plating bath is important for improving the plating process.
Copper - Wikipedia
Reduction of Cu(I) concentration on the air bubbling time. Absorbance
Electrodeposition of Copper for Three-Dimensional Metamaterial Fabrication
Increase of current density by electrolysis for 0 to 10 min.
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A novel method of rapid detection for heavy metal copper ion via a specific copper chelator bathocuproinedisulfonic acid disodium salt
Accumulation & Analysis-Cuprous Ions In Copper Sulfate Plating Solution l Protocol Preview
Accumulation and Analysis of Cuprous Ions in a Copper Sulfate Plating Solution
A novel method of rapid detection for heavy metal copper ion via a specific copper chelator bathocuproinedisulfonic acid disodium salt
4,6-Dimethyl-2-mercaptopyrimidine as a potential leveler for microvia filling with electroplating copper - RSC Advances (RSC Publishing) DOI:10.1039/C7RA06857C
Figure 6 from Analysis of Cu(I) in Copper Sulfate Electroplating Solution